AcePlas at NEPCON Japan 2025: Recap and Highlights
May 23, 2026
AcePlas successfully exhibited at NEPCON Japan 2025, one of Asia's largest electronics manufacturing trade shows held at Tokyo Big Sight from January 22-24.
Our booth showcased:
- Full range of carrier tapes (8mm-88mm)
- New transparent anti-static cover tape with improved peel consistency
- Smart ESD turnstile with cloud connectivity
- Custom ESD packaging solutions for semiconductor clients
We connected with over 200 potential customers and distributors from Japan, Korea, Taiwan, and Southeast Asia.

